The foundation stone for India’s first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar, Odisha. The project marks a significant step in strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing.
About the Project
- The project is being implemented by 3D Glass Solutions Inc. (3DGS), USA, through its wholly owned Indian subsidiary, “Heterogeneous Integration Packaging Solutions Pvt. Ltd. (HIPSPL)”, at Info Valley, Khordha district, Odisha.
- It is a greenfield, vertically integrated advanced packaging and embedded glass substrate ATMP (Assembly, Testing, Marking & Packaging) facility, the first of its kind in India.
Investment & Financial Support
- Total Investment: ₹1,943.53 crore
- Central Fiscal Support (approved): ₹799 crore
- State Support (Odisha): ~₹399.5 crore
Target Sectors
The facility will cater to high-growth sectors including Data Centres, Artificial Intelligence, Machine Learning, 5G/6G Communications, Automotive Radar, Defence Electronics, Aerospace Applications, and Photonics.
Timeline
- Commercial Production: By August 2028
- Full-Scale Volume Production: By August 2030