Odisha government has signed a Memorandum of Understanding (MoU) with Intel Corporation and 3D Glass Solutions Inc. in Santa Clara, California, to establish an advanced semiconductor packaging facility in India.
The proposed unit will be set up in the Bhubaneswar–Khurda region and represents one of the largest high-technology manufacturing investments in the country.
Key Highlights
Implementation Timeline: Project to be executed in phases over 5–6 years
Investment & Scale
- Estimated investment: USD 3.3 billion
- Among the largest high-tech manufacturing investments in India
Manufacturing Focus: The facility will produce-
- Advanced packaging glass-core substrates
- High-density interconnect substrates
- Other semiconductor packaging technologies
- Intel Corporation will provide technology know-how and process expertise
Alignment with National & State Vision
- Supports Atmanirbhar Bharat initiative
- Aligns with Odisha Vision-2036
- Contributes to the India Semiconductor Mission
Objective:
- Build a robust domestic semiconductor ecosystem
- Enhance supply chain resilience
- Strengthen India’s role in global semiconductor value chains
Employment Generation
- Direct jobs: Over 1,800 high-skilled positions
- Indirect jobs: Significant opportunities across manufacturing and technology sectors